-lannayaba pogo pin ɲɔgɔndan padsmin be sanu gɛlɛnw n’a dilancogo ɲuman yira. A ka ɲi ka kɛ minanw ye minw be se ka don -minɛnw na minw be se ka charge, furakɛli sɛgɛsɛgɛri minanw, izini ka sɛgɛsɛgɛrikɛminanw, ani board-to-board interconnects-minw be porozew dɛmɛ ka bɔ porototipiw la ka taga n’u ye ka taga n’u ye.

Mun naPogo Pin ɲɔgɔnkunbɛnyɔrɔLabɛncogo b’a yira ko sisitɛmu be se ka la a la

Ɛnsɛniyeriw fanba b’u sinsin pogo pin yɛrɛ lo kan k’a sɔrɔ u be ɲɔgɔnkunbɛn yɔrɔ minɛ i n’a fɔ koo filanan. Tiɲɛn na, tuma caaman na, dɛsɛw be kɛ yɔrɔ min na.

Saan 15 tɛmɛninw na, an ye dɛsɛ cogo kelenw kɔrɔsi siɲɛ caaman poroze caaman na:

Kontakti pads minw ka dɔgɔ kojugu ka se ka mekaniki yɛlɛmaniw wala boonw muɲu.

Ɲɛyirali fɛ, yɔrɔ minw ka ɲi ka dɔgɔya, olu sugandira walisa ka dɔ bɔ musakaw la fɛɛnw na minw be se ka 50 000 ɲɔgɔndanw muɲu.

Zira-plated pad dilan cogo tilennin minw be kɛ ka baara kɛ ni kura -ba ye k’a sɔrɔ u ma jateminɛ kɛ funteni yɛlɛmani n’a ka funteni kɔlɔlɔw kan.

O koo nunu si tɛ gwɛlɛya kɛrɛnkɛrɛnnin ye. Gwɛlɛya min b’a la, o ye ka desizɔn ɲumanw ta sanni ka porototipi fɔlɔ dilan, sanni k’a ɲini ka gwɛlɛyaw latilen kɔfɛ. O yɔrɔ la, poroze caaman be wagati jan ta ani u be wari caaman sara.

An ye kalan minw sɔrɔ o porozew la, nin ɲɛɛ b’u surunya, k’u ɲɛsin ɲɔgɔnkunbɛnyɔrɔw hakɛ ma, nɛgɛdaga sugandicogo ma, sisan-minɛcogo ma ani labɛncogo ladilikanw ma.

Mun lo b’a to Pogo Pin be se ka la a la?

Lanaya be bɔ koo saba lo la minw be ɲɔgɔn minɛ:mekaniki bɛnbaliya, sanfɛla kemikɛli, ani funteni danfara. Ka kelen dɔrɔn lo fisaya k’a sɔrɔ i t’i janto tɔw la, o be se ka kɛ sababu ye ka dilanfɛn dɔ dilan min be tɛmɛ kɔrɔbɔli fɛ nka a be dɛsɛ ka baara kɛ ni diɲɛ yɛrɛ yɛrɛ ye.

Masini baara: Kontakti fanga ani tagama

Stable low contact resistance be ɲɔgɔnkunbɛn fanga basiginin lo wajibiya a ka ɲɔgɔnkunbɛn yɔrɔ bɛɛ la. Pogo pin dilancogo dantigɛlenw ka teli ka di .30–150 gf ka ɲɔgɔnkunbɛn fanga(ka kɛɲɛ ni pɛnɛ diamɛtiri ye ani tagama ye), ni ɲɔgɔnkunbɛn fanga ye ka cayamΩ duguma.

O la, a ka ɲi ka lɔn ko mɔgɔw be se ka ɲɔgɔn sɔrɔ cogo min na, o tɛ nagasi linearly. Nka, a b’a fɛ ka yɛlɛ kosɔbɛ fanga kurun labanw na. Dilan minw be baara kɛ ka surunya dan na min ka dɔgɔ ni bɛɛ ye, olu be yɛlɛma kɛrɛnkɛrɛnnin na ka kɛɲɛ ni dilan ni lajɛnba muɲuli ye.

Ka ɲɛsin baarakɛminɛnw ma minw ka baara ka ca -i n’a fɔ ICT sɛgɛsɛgɛrikɛminanw wala chargement docks minw jatelen don .ka tɛmɛ 20 000 kan-a jɔɔsi-ɲɔgɔnye dilan cogoa ka ca a la, o lo ka di mɔgɔw ye. O yɛlɛmani be dɛmɛ don ka oksidiw bɔ yɔrɔ sanfɛla la ɲɔgɔndan kelen kelen bɛɛ la, o min b’a to a be se ka baara kɛ ka mɛn ka tɛmɛ yɔrɔ min be ɲɔgɔn minɛ ni ɲɔgɔn ye.

Dugukolo sanfɛla simi: nɛgɛdaga sugandili

O pad yɔrɔ n’a ka pin piston kuncɛ be kɛ elekitorosimiki fila ye. Ka bɛn n’u ye - sanu gɛlɛn ENIG pad kan, misali la - be sɔgɔli teliya yɔrɔ nɔgɔman kan ani ka nɔgɔw bɔ minw be dɔ fara fanga kan wagati dɔ kɔnɔ.

An ka sɛrɛkili min be kɛ ni sɛrɛkiliw ye, o be baara kɛ ni nikɛli difuziyɔn barikada ye (3–5 μm) sanu gɛlɛn jukɔrɔ min be yɛlɛmayɛlɛma (0,3–0,8 μm). Nikɛli be sanu bali ka taga zira kɔnɔ; sanu gɛlɛn le bɛ fani don. IEC 60512-6-4 ka ɲɛnamaya kɔrɔbɔli telimanw kɔnɔ, fanga yɛlɛmani be to 5% duguma ka tɛmɛ 10,000 kan yɛlɛmaniw kama minw be se ka don mɔgɔ la, ani 1,000,000 yɛlɛmaniw fɛ ka ɲɛsin fani doncogo ɲumanw ma - nunu tɛ kelen ye ani u tɛ kelen ye.

Funteni: sisan setigiya ani yɛlɛmani

Kɔlɔn kelen-labɛnnin ka ɲɔgɔnkunbɛn 2 oz zira kan be se ka 3–5 A ta tuma bɛɛ ni funteni yɛlɛli ye degere 30 jukɔrɔ degere 25 lamini na. Nka lamini funteni kɔrɔtanin lo ka tɛmɛ kunnafoni sɛbɛw fanba sɔnna min ma:

O la, a be se ka kɛ ko 5 A ka ca ni 5 A ye, paralɛli pad konfigurasiyɔnw be doni tilan ani ka dɔ bɔ per-pad ka funteni gɛlɛya la. An be thermique simulation kɛ DFM sɛgɛsɛgɛri wagati la dilanfɛn o dilanfɛn kan min ka ca ni 3 A ye pad kelen kelen bɛɛ kan.

PCB Pogo Pin Pad labɛncogo: Bonya ni yɔrɔ sariyaw

Pogo pin landing pad bonya b’a yira ni pin be se ka ɲɔgɔn sɔrɔ cogo ɲuman na i ka soo ka muɲuli sɛrɛkili bɛɛ la, PCB dilanni ani mekaniki tilenninya sisitɛmu. Undersizing be na ni ɲɔgɔnkunbɛn ye tuma o tuma; mɔgɔw ka bonya ka tɛmɛ o kan, o be yɔrɔ tiɲɛ ani ka tagamasiɲɛw ka tilenninya gwɛlɛyaw lawuli yɔrɔw la minw ka ca.

Pad janya ladilikanw

O la, a be se ka kɛ ko ±0.1 mm PCB dilan muɲuli ka fara mekaniki float tipikali kan snap-fit walima magnetic-alignment boonw kɔnɔ. Ni i ka bon be baara kɛ ni pɛnɛ wala dowel ye min be mɔgɔw labɛn ka ɲɛ, i be se k’o muɲuli nunu sɛgɛsɛgɛ - i ka ɲɔgɔnye kɛ n’an ye n’i ka soo ja ye ani an bena ladili di.

Labɛn kɛcogo minw be dɛsɛ caaman bali

Padi minw be dan na, u tɛ zira jii la.Ka pads nɔrɔ ɲɔgɔn na ni zira bɔnin ye k’a sɔrɔ i ma funteni bɔ, o be solder gɛlɛya ani o be se ka kɛ sababu ye ka funteni tilen min be yiri misɛnw yɛlɛma. Aw ka baara kɛ ni pads isolés ye minw be ni vias ye walisa ka funteni jɛnsɛn yɔrɔ minw na a mako be yen.

Sanu gwɛlɛman be se ka kɛ pad o pad ye min ka ca ni 5 000 ye.ENIG be se ka solder ani a sɔngɔ ka dɔgɔ nka a be tiɲɛ joona ni mekaniki be ɲɔgɔn sɔrɔ. Nikɛli yɔrɔ min ENIG be bɔ kɛnɛ kan sanu sɔgɔnin kɔ, o ka gwɛlɛ ka tɛmɛ sanu yɛrɛ kan - ɲɔgɔnkunbɛn fanga be caya ani a be kɛ fɛɛn ye min tɛ se ka fɔ ka bila. Ka ɲɛsin chargement contacts walima test fixations ma, electrolytique sanu gɛlɛn kofɔ board dilan wagati la.

Keep-bɔ yɔrɔw nafa ka bon ka tɛmɛ yɔrɔ caman na.DC walima low frequency la, 0.3 mm keep-bɔ tagamasiɲɛ- min be ɲɔgɔnkunbɛn fɛnw cɛ, o be se ka kɛ baarakɛcogo fanba la. GHz sanfɛ, dɔ fara keep-out kan ani dugukolo fa fara pads cɛ ka crosstalk mara. Aw k’o sɛbɛ aw ka dizayin pake kɔnɔ ani an bena a lajɛ Gerber ka sɛgɛsɛgɛri wagati la.

Ka tɛmɛ sigiyɔrɔ kan sisan-minɛfɛnw ta.Pads minw ka ca ni 2 A ye, aw ka thermovia fara a kan board faan wɛrɛ la walima dugukolo/power plan dɔ kan. 0.3 mm via kelen be 0.5 A - ɲɔgɔn ta 3 A pad kama, labɛn kɛ ka via 6–8 ɲɔgɔn lajɛn pad sennɔ kɔnɔ.

Ka fani ɲuman sugandi i ka sɛbɛri kama .

Plating sugandili jugu tɛ dɛsɛ o yɔrɔnin bɛɛ - a be dɛsɛ 3 000 ɲɔgɔnna tuma min na minɛn be foro kɔnɔ ka ban. Nin ye cogo min na i be se ka plating bɛn n’i ka baarakɛcogo yɛrɛ yɛrɛ ye.

Elektroliti sanu gɛlɛn

A ka fisa ni: chargeur donta ye, furakɛli minanw ka interfaces, test fixtures de cycle high-, application sugu o sugu min ka ca ni 5 000 mating cycles ye.

A ka bon: 0,3–1,0 μm nikɛli barikada kan. A ka gwɛlɛ ka tɛmɛ sanu nɔgɔman kan (Knoop gɛlɛya 130–200 HK vs. 60–90 HK sanu nɔgɔman kama), min be bayɛlɛma ka ɲɛ ka ɲɛnamaya don. O yɛlɛmani ye solderability ye - sanu gɛlɛn tɛ ɲuman ye yɔrɔw la minw fana bena kɛ wave walima reflow solder ye.

ENIG (nikɛli min tɛ kuran na / sanu min be jigi)

A ka fisa: baarakɛminanw ɲagaminin -minw mako be solderability ani mekaniki ɲɔgɔnkunbɛn na tuma o tuma, baarakɛcogo minw ka dɔgɔ (minw tɛ 3 000 don), sɔngɔ-sensible designs yɔrɔ minw na chargement man teli ka kɛ.

Sanu min be don ENIG kɔnɔ, o ka dɔgɔ kosɔbɛ (0,05–0,1 μm) ani a bena tiɲɛ n’a be to ka ɲɔgɔn minɛ. Ni nikɛli bɔra kɛnɛ kan, aw k’a miiri ko a bena dɔ fara a ka ɲɔgɔnkunbɛn fanga kan. Smartwatch min be charge loon o loon, o ye gwɛlɛya ye saan kelen kɔnɔ n’a y’a baara. Barkod scanner min be dock siɲɛ kelen shift kelen kelen bɛɛ la, o be sɔn o ma.

ENEPIG

A ka fisa ni: baarakɛminanw ye minw mako be ɲɔgɔnkunbɛn na min be se ka la a la ani solderability ɲuman ye pad kelen kan - min ka ca furakɛli minanw na yɔrɔ min na pad be baara kɛ ni chargement ani test-point function ye. A sɔngɔ ka gwɛlɛ ka tɛmɛ ENIG kan, a ka ɲi tuma min na pad ka ɲi ka baara fila kɛ.

Warijɛ nɔrɔli

A ka fisa ni: sɔngɔ-sensitive DC fanga ɲɔgɔndanw ye yɔrɔw la minw tɛ-gɛlɛnw ye, RF ɲɔgɔndanw yɔrɔ minw na farikolo-effet conductivité ka kan. Wari be nɔgɔ yɔrɔ minw na jii be sɔrɔ wala kibiri- be sɔrɔ yɔrɔ minw na, o be dɔ fara a ka ɲɔgɔnkunbɛn kan. A man ɲi ka kɛ kɛnɛma wala furakɛli baara ye.

PCB ka ɲɔgɔnkunbɛnyɔrɔ min be baara kɛ ni sisan ye: a dilanna ka ɲɛsin funteni yɔrɔ ma

I2R ka funteni modɛli ka nɔgɔ: fanga min be bɔ, o be bɛn sisan kaare siɲɛw ka fanga ma. mΩ ka kɔntakti pad min be 3 A ta, o ye 225 mW - ye min be sɔrɔ yɔrɔ fitinin dɔ la. O yɔrɔ la, funteni sira min be bɔ o pad la ka taga lamini na, o lo b’a yira ni funteni yɛlɛmani be to a ka yɔrɔ la.

Fɛɛn minw be nɔɔ to sisan ka setigiya kan .

Zira girinya.1 oz zira (35 μm) ye sariya ye; 2 oz (70 μm) be yɔrɔ min tigɛra, o be se ka kɛ siɲɛ fila ye ani a be fanga dɔgɔya ni ~50% ye. Pads minw ka ca ni 3 A ye, 2 oz zira kofɔ walima ka pads caaman ta ɲɔgɔn fɛ.

Pad isolation vs. zira bɔn ɲɔgɔndan.Pad min be dan na ni vias ye, o be funteni bɔ ka ɲɛ ka tɛmɛ pad min nɔrɔnin be zira bɔnyɔrɔba la, sabu bɔnyɔrɔ be baara kɛ i n’a fɔ funteni bɔyɔrɔ dɔrɔn n’a be ni funteni sira ye ka taga lamini na. Tablo min be ni yɔrɔ caaman ye ani a kɔnɔnafɛnw be yen, ka yɛlɛmayɛlɛmalanw nɔrɔ ɲɔgɔn na ni fanga ye ka tɛmɛ thermal vias fɛ, o lo ye funteni maracogo ɲuman ye.

Pad bonya.Pad belebelebaw be funteni jɛnsɛn nka u be dɔ fara inductance ni capacitance - kan fana min ka ɲi RF baarakɛcogow ma. DC chargement kama, i ka pad bonya kɛ ka kɛɲɛ ni sisan ka makoya ye, i kana kɛ ka kɛɲɛ ni fitinin ye min be bɛn ni pin ye.

Ni Pogo Pin Kontakti Pad tɛ fura ɲuman ye .

An be spring contact pads ladili baara caaman kama, nka koo dɔw be yen minw na fɛɛrɛ wɛrɛ ka fisa - ani an b’a fɛ k’o fɔ aw ye sisan ka tɛmɛ baarakɛminanw tigɛnin kɔ.

Donni hakɛ ka dɔgɔ kosɛbɛ, ɲɔgɔndan banbali le ka di.Ni ɲɔgɔndan bena kɛ siɲɛ kelen lajɛnba wagati la ani a tɛna kari tugun, ɲɔgɔndan min be kɛ ni solder wala press-fit ye, o be se ka la a la ani a sɔngɔ man gwɛlɛ. Spring contacts be nafa dɔ fara a kan n’u be segi ka ɲɔgɔn minɛ siɲɛ caaman, o ye labɛnni waajibi ye.

Lamini minw be yɛrɛyɛrɛ kosɔbɛ -minw tɛ ni datugulan ye.Pogo pɛnɛ ɲɔgɔnkunbɛnw be ɲɔgɔnkunbɛn mara ressort fanga dɔrɔn sababu la. Lamini minw be to ka yɛrɛyɛrɛ kosɔbɛ (mobiliw ka fanga, izini ka masin girinmanw), pɔrɔn be se ka bɔ ɲɔgɔn na ni yɛrɛyɛrɛ ye hali n’a be komi boon lajɛnin lo. O koo nunu na, i ka nɛgɛjuruw yira minw be ni nɛgɛjuru filanan ye.

Nɔgɔ-lamini girinmanw ni IP tagamasiɲɛ tɛ.Ressort ka yɔrɔ min be tigɛ jii la, sɛnɛfɛnw wala buguri min be bɔ dugukolo jukɔrɔ, n’a ma datugu ka ɲɛ, o tɛna nɔgɔ, hali ni sanu be kɛ cogo min na. Ni lamini datugucogo tɛ se ka labɛn ɲɔgɔnkunbɛnyɔrɔ lamini na, i ka ɲɔgɔndancogo dɔ sugandi min datugunin lo.

Extremely high current density (>10 A kelen kelen bɛɛ la).A sanfɛ ɲɔgɔnkunbɛn kelen kan, funteni marali be gwɛlɛya kosɔbɛ ni ɲɔgɔnkunbɛn geometriw ye minw be bɛn ni sɛrɛkiliw ye. Bisi bar walima high-sisan ɲɔgɔndan fɛɛrɛw lo bɛnnin lo ka tɛmɛ.

A baarakɛcogo misaliyaw

Chargeur min be se ka don

Smartwatch ani fitness tracker chargeur docks ye -volume application ye min ka ca ni bɛɛ ye ka ɲɛsin sɛnɛfɛnw ma. O dilan cogo ka dankariw ka gwɛlɛ: pad yɔrɔ ka dɔgɔ, donyɔrɔ hakɛ ka ca (a loon o loon-smartwatch docks be baara kɛ siɲɛ 365 saan kɔnɔ), ani jii nɔgɔyali laɲiniw (IPX7 walima IP68) be dankari kɛ cogo min na nɛgɛkunbɛnnan be se ka labɛn ɲɔgɔnkunbɛn lamini na.

An ye baara kɛ ka chargement contact designs kɛ ka tɛmɛ platform caman kan minw be se ka don mɔgɔ la. An be min ye, o ye ENIG pads ye min be sɔrɔ fɛɛnw na minw labɛnna saan caaman kɔnɔ loon o loon. Ka sanu gɛlɛn yira 0,5 μm la, o be sɔngɔ damadɔ fara boon kelen kelen bɛɛ kan; ka chargement contacts yɛlɛma garanti kɔsegi la, o sɔngɔ ka ca kosɔbɛ.

Dɔgɔtɔrɔya sɛgɛsɛgɛli vitro kɔnɔ

IVD minɛnw ka ɲi ka biyɔkompabilite sariyaw labato yɔrɔ o yɔrɔ la min be se ka maga biyɔlozi sɛgɛsɛgɛrifɛnw na wala dɔgɔtɔrɔso baarakɛlaw bolo la. O baarakɛminɛnw kɔnɔ, mɔgɔw ka teli ka baara kɛ ni sɛgɛsɛgɛrikɛlanw ye, banabagatɔw-yɔrɔw tɛ, nka sɛbɛw ka ɲi ka kɛ minw na, u kɔrɔtanin lo hali bi. An be minanw ka kunnafoniw di, RoHS/REACH ka sariyaw labatoli sɛbɛw ani mɔgɔw be se ka minw lɔn i n’a fɔ sariyaw be di dɔgɔtɔrɔso sannikɛlaw ma.

ICT ani FCT kɔrɔbɔli minanw

SMT sɛgɛsɛgɛli yɔrɔ minw ka ca -sɛgɛsɛgɛli yɔrɔw la in-circuit kɔnɔ ani baarakɛminanw sɛgɛsɛgɛli minanw be yɛlɛma yɛlɛma ka tɛmɛ fɛn bɛɛ kan - min be se ka sɛgɛsɛgɛli kɛ 1 000 kan loon o loon. O hakɛ la, 100 000-sikili hakɛ be sɔrɔ kalo naani kɔnɔ. O baarakɛcogow kama, an be sanu nɛgɛ min ka gwɛlɛ ka tɛmɛ tɔɔw bɛɛ kan, an b’o lo yira ani an be porogramu dɔw ladili minw basiginin lo yɛlɛmaniw jate yɛrɛ yɛrɛ kan sanni ka kɛɲɛ ni kaloladon wagati ye.

Mobili tablo-ka -tablo ɲɔgɔndanw

ECUw, sensɔri modɛliw ani fanga tilanyɔrɔw ka ɲɔgɔnkunbɛnw be to ka baara kɛ ni pɔrɔnw ye sanni ka baara kɛ ni laada nɛgɛjuruw ye. O baarakɛcogow ka kan ka bɛn ni AEC-Q200 kɔnɔfɛnw ka sariyaw ye ani u ka kan ka yɛlɛma yɛlɛma (-40 degere ka taga se +125 degere ), yɛrɛyɛrɛ ka kɛɲɛ ni ISO 16750 ye, ani jimanya ka kɛɲɛ ni ISO 6270 ye.

Dilan cogo

• Poroze sariyaw: Jaaw dilanni be di baaralon 1 kɔnɔ
• Labɛn kɛrɛnkɛrɛnninw: Jaa minw dilanna, u be di baara tile 1–3 kɔnɔ

Fɛɛn minw be se ka di

1. 2D jaaw ani u ɲɛfɔcogow
2. 3D modɛliw
3. Minɛnw ani fani doncogo ladilikanw
4. Sɔngɔ di
5. Prototype dɛmɛ: Ka mɔgɔw ka sago dilan walima ka porototype misaliya dilan.

Mɔgɔw ​​ka teli ka ɲiningali minw kɛ

Pad hakɛ min ka ɲi ka kɛ pogo pin kontakti ye, o ye jumɛn ye?

O la, a ka kan ka kɛ ko a ka kan ka kɛ pin plunger diamɛtiri ye ka fara 0,5–0,8 mm kan walisa ka PCB dilan muɲuli ani mekaniki tilenninya float jate. 1,0 mm pin, o kɔrɔ ko 1,5–1,8 mm pad. Ni i ka bon be baara kɛ ni yɛlɛmaniw ye minw be kɛ ni tilenninya ye (dowel pins, moulded guides), i be se k’o sɛgɛsɛgɛ ka +0.3 mm - i ka soo muɲuliw tilan ani an bena ladili di. Ka pad bonya dɔgɔya, o lo ka teli ka kɛ sababu ye ka ɲɔgɔn minɛ tuma o tuma porototipu lɔli la.

Tuma juman lo n’ ka ɲi ka baara kɛ ni sanu gɛlɛn ye ENIG nɔɔ na?

Ni i ka fɛɛn bena ɲɔgɔn sɔrɔ ani n’a tɛna ɲɔgɔn sɔrɔ siɲɛ 3 000 ni kɔ a ka baara wagati bɛɛ la, i ka sanu gɛlɛn min be se ka yɛlɛma yɛlɛma, o yira. Smartwatch min be sara loon o loon, o dancɛ be se saan seegi kɔnɔ - ka ɲɛ fɛɛn ka ɲɛnamaya kɔnɔ. Kɔrɔbɔli fixture kama, a be se tile damanin kɔnɔ. ENIG bɛnnin lo baarakɛyɔrɔw ma minw ka baara ka dɔgɔ wala pads minw mako be solder la fɔlɔ sanni ka ɲɔgɔn minɛ ni masin ye.

Kontakti pad kelen be se ka kuran hakɛ juman lo ta?

Pad min dilanna ka ɲɛ 2 oz zira kan yɔrɔ min na fiɲɛ be sɔrɔ yɔrɔ min na, o be se ka 3–5 A ta ni funteni be yɛlɛma ka se degere 30 ma degere 25 lamini na. A be yɛlɛma ka se 50–60% ma degere 85 la. Doni minw ka ca ni 5 A ye, an be paralɛli padw ladili sanni pad kelen min ka bon kojugu - a be kuran ni funteni doni fila bɛɛ tilan cogo kelen na, ani a be sensitivite dɔgɔya -yɔrɔ kelen ɲɔgɔnkunbɛn dɛsɛ la.

Yala o ɲɔgɔnna fɛnw be se ka kɛ ka fɛɛnw dilan minw tɛ se ka jigi wa?

Ɔnhɔn, ni tagamasiɲɛ ɲuman ye min be ɲɔgɔnkunbɛnyɔrɔ lamini. O pad yɛrɛ tɛ jii nɔgɔlan ye - min be so ka gasi wala a ka fani min be yɛlɛma ka tɛmɛ. An ye IP67 ani IP68 dilan cogo dɛmɛ fani doncogo ani izini ka baarakɛcogow bɛɛ la. O la, a ka ɲi ka la a la ko yɔrɔ min be datugu, o be bɛn ni ressort ka fanga ye; fanga min ka ca kojugu, o be gaziw nɔgɔmanw tiɲɛ ani o be se ka nɛgɛkunbɛnnanw tiɲɛ tiɲɛn na.

Janya min ka dɔgɔ ni ɲɔgɔn ye, o ye juman ye?

Keep-out yɔrɔ min ka dɔgɔ ni ɲɔgɔn ye, o ye milimɛtiri 0,3 ye nɛgɛw la minw bonya be milimɛtiri 0,8 duguma, ani milimɛtiri 0,5–0,8 ye nɛgɛw belebelebaw la. O ye dilanni fitininw ye - ka ɲɛsin baarakɛminɛnw ma minw ka fanga ka bon walima tagamasiɲɛ minw ka fanga ka bon, ka dɔ fara yɔrɔw kan ka kɛɲɛ ni yɛlɛmayɛlɛma ni yɔrɔ bɔli laɲiniw ye walima tagamasiɲɛw ka tilenninya modɛli.

N’ be se ka dɔ bɔ ɲɔgɔnkunbɛn na cogo di dilan cogo dɔ la?

Fɛɛn saba lo b’a to mɔgɔw be se ka ɲɔgɔn minɛ: u ka se ka ɲɔgɔn minɛ ani u ka bon, u ka ɲɔgɔn minɛ fanga ani u sanfɛla saniyako. Sanu gɛlɛn min be 0,5 μm la, fanga min be ɲɔgɔn minɛ ka tɛmɛ 80 gf kan, ani ɲɔgɔnkunbɛn geometri min be jɔɔsi, o bena se ka 20 mΩ jukɔrɔ dilanni na. N’i ​​be fanga caman suma dilan boonw kɔnɔ, i ka pad surface oxidation sɛgɛsɛgɛ (ENIG boonw minw marala ka tɛmɛ kalo 6 kan, u b’a yira ko fanga be se ka suma) ani i k’a filɛ n’i ka soo be se ka pin compression min kofɔra.

Yala i be dɛmɛ don -batch fitininw wala porototipu komandiw la wa?

Ɔnhɔn. An tɛ ni komandi fitinin ye min ka ɲi ka kɛ porototipi stade la. O la, a be se ka kɛ ko tile 3–5 lo be Gerbers ni quotation fɛ; porototipu tablo dilanni be bɔ i ka fab lo la, an tɛ. Ka ɲɛsin geometriw ma, an mako be lɔgɔkun kelen wɛrɛ la ka DFM lajɛ ani ka baarakɛminanw sɛgɛsɛgɛ.

Sɛrɛkili jumanw lo be sɔrɔ i ka contact pad ka fɛɛnw na?

Fɛɛn minw be ci ka taga, u be bɛn ni RoHS ka sariya 2011/65/EU ye, ani REACH SVHC ka sariyaw ye. ISO 9001:2015 ka sɛbɛ be an ka baarakɛyɔrɔ lo kofɔ. Minanw ka kunnafoniw ani kɔrɔbɔli rapɔɔriw be sɔrɔ n’u y’u ɲini.

Fɛɛrɛw yiracogo yɔrɔnin kelen

O kɔnɔkow lajɛra baarakɛcogo lɔnbaga dɔ fɛ min be ni saan 12 ka lɔnniya ye ɲɔgɔnkunbɛn ɲumanw ani minanw dilanni na minw be se ka don mɔgɔ la ani furakɛlifɛnw dilanni na. Fɛɛrɛw kunnafoniw basiginin lo kɔnɔnakow kan ka kɛɲɛ ni IEC 60512-6-4 ani MIL-STD-1344 ye.

Ladilikan ɲini pad labɛncogo kan- i ka pin dantigɛli, so ja, ani sikili/sisan laɲiniw tilan. An bena jaabili di ni labɛncogo ladili ye ani tile 3–5 baara tile 3–5 kɔnɔ.

A’ y’a ladon: Pogo Pin Pad dilan cogo sɛgɛsɛgɛri sɛbɛ (PDF)- a kelen-sɛbɛn yɔrɔ min be pad bonya, plating sugandi, sisan derating, ani dɛsɛ cogoyaw kofɔ.

Min be bɔ ɲɔgɔnw ma:Pogo Pad |Pogo Pin dilanbaga | Pogo Pin feerebagaw| Pogo Pin ɲɔgɔnkunbɛnyɔrɔ